具有挑戰性的工作面試問題 (PART C) 研究生英文編修出版投稿日報 10/20/2015

Drosera capensis Luc Viatour

研究生英文編修出版投稿日報:
* 具有挑戰性的工作面試問題 (PART C)
* 學術英文投稿教學影片(632) Effective feedback & peer review in academic writing
* 結合“精確寫作”及“明白寫作” (英文編修訓練) (6 / 6)
* Viết tiếng Anh học thuật Bảng tin hàng ngàym
* 非正式工程英文技術報告 (114) (下)
Academic publishing news 學術英文編修出版新聞

具有挑戰性的工作面試問題 (PART C)

* 什麼樣的事情惹你生氣或者不高興嗎?舉例說明。

* 在一個研討會或小組的任務中,你如何確保他們聽到你的意見?舉個例子。

* 作為一個學生,你的動機是什麼?你如何保持你的動機居高不下?

* 說明當你的動機低。你怎麼處理?

* 您如何處理問題?舉個例子。

Source: Job Interview Questions (scribd)

學術英文投稿教學影片(632) Effective feedback & peer review in academic writing
觀看本學術英文投稿教學影片以加強英文寫作投稿能力
結合“精確寫作”及“明白寫作” (英文編修訓練) (6 / 6)
科技英文寫作系列之四–“科技英文編修訓練手冊” 強調精確寫作,即如何去除寫作格式錯誤,使作者的意思更為精簡。以下的練習題幫助您複習精確寫作的一般通則,以期可以和本書的明白寫作呵成一氣。

請把練習題列印出來再以紅筆用標準編修註記修改:

9. There is a necessity for a compromise on the proposal by both parties.

10. There is no need for implementation of the environmental awareness program to be the sole responsibility of the organizing committee.

11. The committee is in a position to make sure that the program is capable of being promulgated successfully.

12. It is our opinion that the current system is deficient of an initial prototype.

Answer

科技英文編修訓練手冊 柯泰德

Viết tiếng Anh học thuật Bảng tin hàng ngàym
* Giới thiệu mục đích của phương án (phần 1) (Kỹ năng viết đơn xin việc) (Mô tả sự tham gia trong một dự án phản ánh quan tâm đến một nghề)
* Video giảng dạy viết bài báo tiếng Anh (262): How to Design a Research Poster #1: Basics of Academic Communication
* Tổ chức lớp viết báo khoa học Kỹ thuật đăng trên tạp chí quốc tế (60) (phần 1)
* Nền tảng (Ví dụ:Information Technology)
非正式工程英文技術報告 (114) (下)

強有力的工程英文技術報告包括以下要素:

* 簡要的描述工程方案所關心的事項 。經由一個句子描述工程機構對影響目標工程或客戶有關事項的關心程度。

* 闡明特定部門或客戶所關心的工程環境:管理問題形成的工程環境背景描述。

* 介紹工程問題:工程問題的本質和對與其相關的特定部門或客戶的負面影響。

* 介紹工程方案的目標:工程機構對以上問題最合理的回應

* 工程方案方法論的細節描述:精確的方案步驟描述。

* 工程方案主要成果總結:工程方案對特定部門或客戶立即的利益。

* 工程方案對特定部門或領域的全面貢獻:研究結果和所提方法對工程機構以外更廣大讀者的牽涉。

研讀以下工程計劃以辦別包含的科技論點:

介紹管理方案的目標 Therefore, we developed an analytical geometry method capable of accurately predicting the geometric parameters of practical C4 type solder joint in flip chip technology after a reflow process. 管理方案方法論的細節描述 The differential equation of curvature was derived from the well-known Laplace-Young equation. The contact angle between the solder and substrate and the surface tension of the solder was then measured. Next, the free surface energy of the substrate and the interfacial tension between the solder and the substrate was obtained from Young’s equation. Additionally, the differential equation of curvature was numerically solved to obtain the geometric parameters. Moreover, the geometric data of the solder joint was used as an input in the finite element model to analyze the stress/strain distribution, thermal fatigue life and reliability of the electronic packages. 管理方案主要成果總結Our results indicated that the proposed method can calculate the effect of gravity on the buried high-lead solder bump instead of on the semi-spherical one. Furthermore, the analytical geometry method proposed herein can predict geometric parameters of a C4 type solder joint to within 5% of those obtained by a specific method found in the literature. 管理方案對特定部門或領域的全面貢獻 While considering all of the design factors used to investigate how those factors affect the final shape of a C4 type solder joint, the proposed method provides further insight into how design factors affect the reliability of flip chip technology. The proposed method can also be used to design geometric parameters of a C4 type solder joint, capable of enhancing the reliability of a flip chip package and reducing its stress concentration. Additionally, the results of this study can enhance the reliability and fatigue life of a flip chip package under thermodynamic loading.

有效撰寫英文工作提案 柯泰德

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