具有挑戰性的工作面試問題 (PART B) 研究生英文編修出版投稿日報 10/19/2015

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研究生英文編修出版投稿日報:
* 具有挑戰性的工作面試問題 (PART B)
* 學術英文投稿教學影片(631) Turbo charge your thesis: reading, note-taking and writing
* 結合“精確寫作”及“明白寫作” (英文編修訓練) (5 / 6)
* Viết tiếng Anh học thuật Bảng tin hàng ngàym
* 非正式工程英文技術報告 (114) (上)
Academic publishing news 學術英文編修出版新聞

具有挑戰性的工作面試問題 (PART B)

* 當你不得不同時處理多個任務時, 你成功嗎?舉例說明。

* 描述當你不得不主動解決一個棘手的問題。你做了什麼?

* 在一個團隊工作時,描述您的角色首選?

* 詳細說明您擔任不喜歡的角色情形。你是怎麼管理自己呢?

* 描述當你沒有對工作感到滿意的時候。從這一經驗中你學到了什麼?

Source: Job Interview Questions (scribd)
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學術英文投稿教學影片(631) Turbo charge your thesis: reading, note-taking and writing
觀看本學術英文投稿教學影片以加強英文寫作投稿能力
結合“精確寫作”及“明白寫作” (英文編修訓練) (5 / 6)

科技英文寫作系列之四–“科技英文編修訓練手冊” 強調精確寫作,即如何去除寫作格式錯誤,使作者的意思更為精簡。以下的練習題幫助您複習精確寫作的一般通則,以期可以和本書的明白寫作呵成一氣。

請把練習題列印出來再以紅筆用標準編修註記修改:

5. A significant decline in the investment return occurred.

6. Significant enhancement of conventional procedures by the proposed scheme is possible through the close monitoring of current conditions.

7. The investigator made the suggestion that there is a close relation between the two conditions.

8. The committee came to the conclusion that it is crucial to perform an on-line assessment.

Answer

科技英文編修訓練手冊 柯泰德

Viết tiếng Anh học thuật Bảng tin hàng ngàym

* Nguyện vọng muốn đóng góp trong lĩnh vực liên quan cho công ty (phần 2) (Kỹ năng viết đơn xin việc) (Mô tả các lĩnh vực hoặc ngành công nghiệp mà nghề nghiệp của một người thuộc)

* Video giảng dạy viết bài báo tiếng Anh (261): How to read academic research

* Tổ chức lớp viết báo khoa học Kỹ thuật đăng trên tạp chí quốc tế (59) (phần 2)

* Thực hiện (Ví dụ: Electrical Engineering)

非正式工程英文技術報告 (114) (上)

強有力的工程英文技術報告包括以下要素:

* 簡要的描述工程方案所關心的事項 。經由一個句子描述工程機構對影響目標工程或客戶有關事項的關心程度。

* 闡明特定部門或客戶所關心的工程環境:管理問題形成的工程環境背景描述。

* 介紹工程問題:工程問題的本質和對與其相關的特定部門或客戶的負面影響。

* 介紹工程方案的目標:工程機構對以上問題最合理的回應

* 工程方案方法論的細節描述:精確的方案步驟描述。

* 工程方案主要成果總結:工程方案對特定部門或客戶立即的利益。

* 工程方案對特定部門或領域的全面貢獻:研究結果和所提方法對工程機構以外更廣大讀者的牽涉。

強有力的工程英文技術報告包括以下要素:

簡要的描述工程方案所關心的事項 Our recent effort addressed how to predict the fatigue life nor enhance the yield of a flip chip package. 闡明特定部門或客戶所關心的工程環境 As is well known, geometric parameters significantly affect the reliability of flip chip packaging under thermodynamic loading. Based on the basic material mechanics, a higher solder joint height implies a larger shear force that the solder joint can bear. Moreover, several works have also concluded that cracks occur in a solder joint when a package is under critical thermodynamic loading. Furthermore, certain manufacturing issues, such as packaging falling-off problems, solder bridging and misalignment are also related to the design of the pad and solder joint. 介紹管理問題 However, geometric parameters of a C4 type solder joint still can not accurately predict the reliability of flip chip packaging under thermodynamic loading. Indeed, many engineers have tried to predict the geometric parameters of a C4 type solder joint using an energy-based method and analytical models. Although one of them simulated the C4 type solder joint as a semi-spherical high-lead bump buried into the eutectic solder, the simulation lacks accuracy when the external loading increases. Additionally, the above method disregards the effects of gravity. Moreover, the semi-spherical high-lead bump can not simulate the high-lead bump when the solder pad sizes vary. For instance, if the geometric parameters can not reach an accuracy of 5%, engineers can neither predict the fatigue life nor enhance the yield of a flip chip package. Under these circumstances, engineers can not predict the correct geometric parameters of a C4 type solder joint when the design factors vary. Therefore, engineers can neither predict the fatigue life nor enhance the yield of a flip chip package.

有效撰寫英文工作提案 柯泰德

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