學術刊物如何處理偽造引用的文章? (PART B) (研究出版倫理)研究生英文編修出版投稿日報 3/1/2015

Gardens in Schönbrunn (6)

研究生英文編修出版投稿日報:
* 學術刊物如何處理偽造引用的文章? (PART B) (研究出版倫理)
* 學術英文投稿教學影片 (406) Choosing and Narrowing Research Topics for APA & MLA Essays
* Vietnam: Tổ chức lớp viết báo khoa học Kỹ thuật đăng trên tạp chí quốc tế (24)
* 明白寫作 (英文編修訓練) (7 / 12)
* 非正式工程英文技術報告 (22) (上)
Academic publishing news 學術英文編修出版新聞

學術刊物如何處理偽造引用的文章? (PART B) (研究出版倫理) (柯泰德英文編修翻譯)

* 問:還有其他的學術期刊有類似的問題,什麼是正確的方式來處理這樣的問題?

* 建議:以這種方式更改的引用幾乎就像偽造數據。

* 該期刊的編輯寫信給作者,並解釋說這行為是不可接受的,而作者的機構將被告知這個情況。

* 該期刊編輯還檢查由該作者發表的其他文章,看看這是不是一個長久存在的問題。

* 其他期刊的編輯應該被聯繫,並告知作者這種不當行為。

Committee on Publication Ethics (COPE) (Case No. 10-29)

學術英文投稿教學影片 (406) Choosing and Narrowing Research Topics for APA & MLA Essays
觀看本學術英文投稿教學影片以加強英文寫作投稿力
Vietnam: Tổ chức lớp viết báo khoa học Kỹ thuật đăng trên tạp chí quốc tế (24)

Lac Hong Online Writing Lab
Trung tâm Viết báo Khoa học bằng tiếng Anh Đại học Lạc Hồng

明白寫作 (英文編修訓練) (7 / 12)

科技英文寫作者常常寫非所想,當然誤導了讀者,此時明白寫作就很重要,除了要把文章寫得精確以外,更要使讀者不誤解您的意思。

請把練習題列印出來再以紅筆用標準編修註記修改:

5. After the board meeting was finished, they left the room.

6. It is preferred in standard methods to select a tentative model based on censored data.

7. This study focuses on examination of Taguchi’s two step procedure and demonstrating how the
wafer quality is improved in the deposition process.

8. The two step procedure attempts to identify those factors that significantly affect the signal-
to-noise (SN) ratio and finding the adjustment factors that markedly influence the mean.

Answer

科技英文編修訓練手冊 柯泰德

非正式工程英文技術報告 (22) (上)

* 簡要的描述工程方案所關心的事項 。經由一個句子描述工程機構對影響目標工程或客戶有關事項的關心程度。

* 闡明特定部門或客戶所關心的工程環境:管理問題形成的工程環境背景描述。

* 介紹工程問題:工程問題的本質和對與其相關的特定部門或客戶的負面影響。

* 介紹工程方案的目標:工程機構對以上問題最合理的回應

* 工程方案方法論的細節描述:精確的方案步驟描述。

* 工程方案主要成果總結:工程方案對特定部門或客戶立即的利益。

* 工程方案對特定部門或領域的全面貢獻:研究結果和所提方法對工程機構以外更廣大讀者的牽涉。

強有力的工程英文技術報告包括以下要素:

簡要的描述工程方案所關心的事項 Our project focused on lowering production costs and sustaining or even enhancing product quality of integrated circuit components. 闡明特定部門或客戶所關心的工程環境 As the semiconductor industry rapidly evolves, integrated circuit components continuously develop in line with consumer requirements for thinner and miniaturized electronic products. Wafer chips and system boards have a limited link distance when using a lead frame in conventional semiconductor package technologies, making it impossible for them to conform to high speed communication and high channel density requirements. A collaborative effort between manufacturers of chip packages and carriers has devised a new package technology, i.e., tape automated bonding, a new wafer chip carrier and tape. As a promising alternative to the above limitations, a tape can contain thinner channels with a shorter electrical connection distance between chip and system board to comply with high speed communication and numerous channel requirements. 介紹管理問題 Process capacity index-Cpk is used to determine the capability performance and equipment stability of the tape manufacturing process. Additionally, process capacity index should, in theory, be positively related to production yield. However, production yield is insufficient even when the tape process has an acceptable Cpk value and stable trend chart in statistical process control. Short, open and etching defects are major defect items identified during analysis of yield loss during final visual inspection. For instance, the final visual inspection yield of tape is under 75%. Moreover, major three defect rates are -8.5% for short, -4.3% for open and -2.8% for etching processes. The inability to enhance the production yield of the tape process makes it impossible to achieve a satisfactory production yield owing to the lack of a good Cpk, ultimately incurring high production costs and low product quality.

有效撰寫英文工作提案 柯泰德

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