學術期刊應該如何處理作者不當行為? (PART A)(研究出版倫理)研究生英文編修出版投稿日報 2/26/2015

El Hemisférico, Ciudad de las Artes y las Ciencias, Valencia, España, 2014-06-29, DD 70

研究生英文編修出版投稿日報:
* 學術期刊應該如何處理作者不當行為? (PART A)(研究出版倫理)
* 學術英文投稿教學影片 (403) Why Peer Reviewed Academic Journal Articles Not Magazines?
* Vietnam: Tổ chức lớp viết báo khoa học Kỹ thuật đăng trên tạp chí quốc tế (22)
* 明白寫作 (英文編修訓練) (4 / 12)
* 非正式工程英文技術報告 (21) (下)
Academic publishing news 學術英文編修出版新聞

學術期刊應該如何處理作者不當行為? (PART A)(研究出版倫理) (柯泰德英文編修翻譯)

* 作者D的機構聯繫的學術期刊,並表示,他們發現了嚴重的不端行為的文章,作者D的發表在該期刊。

* 該機構要求該作者D從該期刊收回的文件,但他拒絕這樣做。

* 該機構聯繫該期刊說,該機構的名稱不應該與文章有關。

* 該機構認為,這種不當行為,應立即知道期刊A的讀者。

* 作者中D進行通信時後,該期刊證實,撰文人犯下不當行為,並要求筆者收回紙張。

* 但是,筆者D拒絕這樣做,並提議出版增編,以彌補在期刊上文章的錯誤。

* 雖然該期刊有一個取回文件的權利,該期刊不希望收回文件。

Committee on Publication Ethics (COPE) (Case No. 10-32)

學術英文投稿教學影片 (403) Why Peer Reviewed Academic Journal Articles Not Magazines?
觀看本學術英文投稿教學影片以加強英文寫作投稿力
Vietnam: Tổ chức lớp viết báo khoa học Kỹ thuật đăng trên tạp chí quốc tế (22)

Lac Hong Online Writing Lab
Trung tâm Viết báo Khoa học bằng tiếng Anh Đại học Lạc Hồng

明白寫作 (英文編修訓練) (4 / 12)

科技英文寫作者常常寫非所想,當然誤導了讀者,此時明白寫作就很重要,除了要把文章寫得精確以外,更要使讀者不誤解您的意思。

請把練習題列印出來再以紅筆用標準編修註記修改:

13. The proposed procedure corrects dimensional distortion and errors better.

14. Our company prefers that organization more than their institute.

15. The new company is as competitive, if not more competitive than, existing ones.

Answer

科技英文編修訓練手冊 柯泰德

非正式工程英文技術報告 (21) (下)

強有力的工程英文技術報告包括以下要素:

* 簡要的描述工程方案所關心的事項 。經由一個句子描述工程機構對影響目標工程或客戶有關事項的關心程度。

* 闡明特定部門或客戶所關心的工程環境:管理問題形成的工程環境背景描述。

* 介紹工程問題:工程問題的本質和對與其相關的特定部門或客戶的負面影響。

* 介紹工程方案的目標:工程機構對以上問題最合理的回應

* 工程方案方法論的細節描述:精確的方案步驟描述。

* 工程方案主要成果總結:工程方案對特定部門或客戶立即的利益。

* 工程方案對特定部門或領域的全面貢獻:研究結果和所提方法對工程機構以外更廣大讀者的牽涉。

研讀以下工程計劃以辦別包含的科技論點:
介紹管理方案的目標 Therefore, we developed a measurement method capable of determining the process capability, thus reducing the defect rate and customer complaints by optimizing the process parameters. 管理方案方法論的細節描述 A measurement method for wire bonding tension was reviewed based on replies from the wire bonding defect inline and analysis of customer complaints. Process capability was then estimated accurately. Next, process parameters were optimized by using the Taguchi method to enhance quality of wire bonding. 管理方案主要成果總結According to our results, the proposed measurement method can reduce the wire bonding defect rate from 0.2% to 0.1%. 管理方案對特定部門或領域的全面貢獻 In addition to contributing to efforts to develop a feasible measurement method of wire bonding tension, the proposed method can simulate the root cause of wire bonding defects, ultimately providing a solution for rising wire bonding tension in the IC packaging industry in order to enhance assembly yield and wafer quality.

有效撰寫英文工作提案 柯泰德

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