學術刊物應該如何處理作者研究論文作者順序爭執? (PART B) (研究出版倫理)研究生英文編修出版投稿日報 2/25/2015

Klagenfurt Lendkanal Wasserspiegelung 07102008 1113

研究生英文編修出版投稿日報:
* 學術刊物應該如何處理作者研究論文作者順序爭執? (PART B) (研究出版倫理)
* 學術英文投稿教學影片 (402) Communicating Science
* Vietnam: Tổ chức lớp viết báo khoa học Kỹ thuật đăng trên tạp chí quốc tế (21)
* 明白寫作 (英文編修訓練) (3 / 12)
* 非正式工程英文技術報告 (21) (上)
Academic publishing news 學術英文編修出版新聞

學術刊物應該如何處理作者研究論文作者順序爭執? (PART B)(研究出版倫理) (柯泰德英文編修翻譯)

*在任何情況下,該期刊將繼續進行,一旦它已收到來自作者所有版權的同意形式。

*忠告:因為博士F有利益衝突(作者之一),他應該充當調解人?

*該期刊的編輯應與其他作者聯絡並詢問他們的意見。

*為了避免將來出現類似情況,提交後,所有作者都應該被包括在所有通信中,以確保他們都知道文件已經提交,並了解有關的文件的決定。

*該期刊的編輯也應與大學的教務長聯絡,並要求他進行調查。

*最後,作者要解決這個問題,而不是編輯。這是一個作者之間爭端。如果爭端得不到解決,本文不應該被發表。

Committee on Publication Ethics (COPE) (Case No. 10-35)

學術英文投稿教學影片 (402) Communicating Science
觀看本學術英文投稿教學影片以加強英文寫作投稿力
Vietnam: Tổ chức lớp viết báo khoa học Kỹ thuật đăng trên tạp chí quốc tế (21)
Lac Hong Online Writing Lab

Trung tâm Viết báo Khoa học bằng tiếng Anh Đại học Lạc Hồng

明白寫作 (英文編修訓練) (3 / 12)

科技英文寫作者常常寫非所想,當然誤導了讀者,此時明白寫作就很重要,除了要把文章寫得精確以外,更要使讀者不誤解您的意思。

請把練習題列印出來再以紅筆用標準編修註記修改:
9. The notions can be simply modified by implementing the following procedure:
Select the levels that maximize SN.
Estimate the slope of the linear regression model.
The control factors and the adjustment factors must be identified.
Identify the control factors that significantly affect the variables.
The target must be adjusted as much as possible.

10. To simulate the program, precautions must be taken by the engineer.

11. As a graduate student, my academic advisor gave me much valuable advice.

12. Before examining all of the available options, the decision was made to initiate the plan.

Answer

科技英文編修訓練手冊 柯泰德

非正式工程英文技術報告 (21) (上)

強有力的工程英文技術報告包括以下要素:

* 簡要的描述工程方案所關心的事項 。經由一個句子描述工程機構對影響目標工程或客戶有關事項的關心程度。

* 闡明特定部門或客戶所關心的工程環境:管理問題形成的工程環境背景描述。

* 介紹工程問題:工程問題的本質和對與其相關的特定部門或客戶的負面影響。

* 介紹工程方案的目標:工程機構對以上問題最合理的回應

* 工程方案方法論的細節描述:精確的方案步驟描述。

* 工程方案主要成果總結:工程方案對特定部門或客戶立即的利益。

* 工程方案對特定部門或領域的全面貢獻:研究結果和所提方法對工程機構以外更廣大讀者的牽涉。

研讀以下工程計劃以辦別包含的科技論點:

簡要的描述工程方案所關心的事項 Our recent project examined how to curtail the high wire bonding defect rate and subsequent customer complaints 闡明特定部門或客戶所關心的工程環境 Wire bonding of IC packages is a critical process for both breakdown yield and product reliability. 介紹管理問題 Although intension of first wire bonding has been used to determine the quality of wire bonding, most analyses of wire bonding defects inline and customer complaints with wire bonding defect indicate that the failure location was not located on first wire bonding. For instance, the defect rate caused by wire bonding was 0.2% and three customer complaints were related to wire bonding fault in 10Mpcs production output. The inability to identify the root cause of wire bonding defects and eliminate them makes it impossible to identify the optimal process parameters, exacerbating the high wire bonding defect rate and customer complaints.

有效撰寫英文工作提案 柯泰德

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