學術期刊應該如何處理擅自公佈在文章上的數據? (PART B)(研究出版倫理)研究生英文編修出版投稿日報 1/21/2015

Schwetzingen BW 2014-07-24 11-37-36

研究生英文編修出版投稿日報:
* 學術期刊應該如何處理擅自公佈在文章上的數據? (PART B)
* 學術英文投稿教學影片 (367) Creating an Effective Scientific Poster Presentation
* Vietnam 6.7: Thư xin việc
* 強有力的動詞 (精確英文寫作) (英文編修訓練) (3 / 12 )
* 非正式工程英文技術報告 (12) (下)
Academic publishing news 學術英文編修出版新聞

學術期刊應該如何處理擅自公佈在文章上的數據? (PART B)(研究出版倫理) (柯泰德英文編修翻譯)

* 建議:客座研究員A被聯繫,並要求作出解釋

* 該期刊的編輯可能要發布一個關切,如果調查正在進行中。

* 但是,該期刊可能難以解決這一問題,因為實驗室主任承認,實驗本來可以在其他地方重複,他不能證明已公佈的數據是在
他的實驗室實際生產。

* 實驗室主任應直接聯繫客座研究員A和她現在的研究所。

Committee on Publication Ethics (COPE) (Case No. 12-22)

學術英文投稿教學影片 (367) Creating an Effective Scientific Poster Presentation
觀看本學術英文投稿教學影片以加強英文寫作投稿力
Vietnam 6.7: Thư xin việc
強有力的動詞 (精確英文寫作) (英文編修訓練) (3 / 12 )

如前單元所示,使用動詞使句子意念表現的更清晰,然而,有些動詞讓人感覺並不強勁,無法有力闡示一個動作。動詞如 is, are, was, were, has, give, make, come, 還有 take 等都屬此類。所以, 作者應使用強有力的動詞來指明一個清楚的行為。

請把練習題列印出來再以紅筆用標準編修註記修改:

9. Modification of the process by the engineer is required so that completeness can be
ensured.

10. Networks are prevalent in every part of society.

11. Network topology is a reference to how the computers are physically attached to each other.

12. The board of directors must take action based on its authority.

Answer

科技英文編修訓練手冊 柯泰德

非正式工程英文技術報告 (12) (下)

強有力的工程英文技術報告包括以下要素:

* 簡要的描述工程方案所關心的事項 。經由一個句子描述工程機構對影響目標工程或客戶有關事項的關心程度。

* 闡明特定部門或客戶所關心的工程環境:管理問題形成的工程環境背景描述。

* 介紹工程問題:工程問題的本質和對與其相關的特定部門或客戶的負面影響。

* 介紹工程方案的目標:工程機構對以上問題最合理的回應

* 工程方案方法論的細節描述:精確的方案步驟描述。

* 工程方案主要成果總結:工程方案對特定部門或客戶立即的利益。

* 工程方案對特定部門或領域的全面貢獻:研究結果和所提方法對工程機構以外更廣大讀者的牽涉。

研讀以下工程計劃以辦別包含的科技論點:

介紹管理方案的目標 Therefore, we developed an analytical geometry method capable of accurately predicting the geometric parameters of practical C4 type solder joint in flip chip technology after a reflow process. 管理方案方法論的細節描述 The differential equation of curvature was derived from the well-known Laplace-Young equation. The contact angle between the solder and substrate and the surface tension of the solder was then measured. Next, the free surface energy of the substrate and the interfacial tension between the solder and the substrate was obtained from Young’s equation. Additionally, the differential equation of curvature was numerically solved to obtain the geometric parameters. Moreover, the geometric data of the solder joint was used as an input in the finite element model to analyze the stress/strain distribution, thermal fatigue life and reliability of the electronic packages. 管理方案主要成果總結Our results indicated that the proposed method can calculate the effect of gravity on the buried high-lead solder bump instead of on the semi-spherical one. Furthermore, the analytical geometry method proposed herein can predict geometric parameters of a C4 type solder joint to within 5% of those obtained by a specific method found in the literature. 管理方案對特定部門或領域的全面貢獻 While considering all of the design factors used to investigate how those factors affect the final shape of a C4 type solder joint, the proposed method provides further insight into how design factors affect the reliability of flip chip technology. The proposed method can also be used to design geometric parameters of a C4 type solder joint, capable of enhancing the reliability of a flip chip package and reducing its stress concentration. Additionally, the results of this study can enhance the reliability and fatigue life of a flip chip package under thermodynamic loading.

有效撰寫英文工作提案 柯泰德

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