學術期刊應該如何處理擅自公佈在文章上的數據? (PART A)(研究出版倫理)研究生英文編修出版投稿日報 1/20/2015

Sankt Veit Herzogsburg Wohnfluegel Fenster 19102014 888

研究生英文編修出版投稿日報:
* 學術期刊應該如何處理擅自公佈在文章上的數據? (PART A)
* 學術英文投稿教學影片 (366) How to make a Research Poster Using Illustrator
* Vietnam 6.6: Mô tả các hoạt động ngoại khóa có liên quan đến việc làm (Thư xin việc)
* 強有力的動詞 (精確英文寫作) (英文編修訓練) (2 / 12 )
* 非正式工程英文技術報告 (12) (上)
Academic publishing news 學術英文編修出版新聞

學術期刊應該如何處理擅自公佈在文章上的數據? (PART A)(研究出版倫理) (柯泰德英文編修翻譯)

* 一個研究實驗室主任表示一些使用方法及在他的實驗室獲得的結果在他不知情或許可下被一個客座研究員使用在期刊文章上。

* 實驗室主任承認,實驗可能在其他地方重演,他無法證明公佈結果產生於他的實驗室

* 該期刊的編輯發現,來訪的研究員A和研究實驗室之間沒有正式的合同;實驗室主任曾表示,沒有數據此前已公佈。

Committee on Publication Ethics (COPE) (Case No. 12-22)

學術英文投稿教學影片 (366) How to make a Research Poster Using Illustrator
觀看本學術英文投稿教學影片以加強英文寫作投稿力
Vietnam 6.6: Mô tả các hoạt động ngoại khóa có liên quan đến việc làm (Thư xin việc)
強有力的動詞 (精確英文寫作) (英文編修訓練) (2 / 12 )

如前單元所示,使用動詞使句子意念表現的更清晰,然而,有些動詞讓人感覺並不強勁,無法有力闡示一個動作。動詞如 is, are, was, were, has, give, make, come, 還有 take 等都屬此類。所以, 作者應使用強有力的動詞來指明一個清楚的行為。

請把練習題列印出來再以紅筆用標準編修註記修改:

5. The larger the TOPSIS value, the better the product quality is implied.

6. The larger the target, the higher the accuracy.

7. The engineer must make an adjustment of the parameters so that accuracy can be ensured.

8. This article makes a comparison of several industrial strategies in order to ensure market
competitiveness.

Answer

科技英文編修訓練手冊 柯泰德

非正式工程英文技術報告 (12) (上)

強有力的工程英文技術報告包括以下要素:

* 簡要的描述工程方案所關心的事項 。經由一個句子描述工程機構對影響目標工程或客戶有關事項的關心程度。

* 闡明特定部門或客戶所關心的工程環境:管理問題形成的工程環境背景描述。

* 介紹工程問題:工程問題的本質和對與其相關的特定部門或客戶的負面影響。

* 介紹工程方案的目標:工程機構對以上問題最合理的回應

* 工程方案方法論的細節描述:精確的方案步驟描述。

* 工程方案主要成果總結:工程方案對特定部門或客戶立即的利益。

* 工程方案對特定部門或領域的全面貢獻:研究結果和所提方法對工程機構以外更廣大讀者的牽涉。

研讀以下工程計劃以辦別包含的科技論點:

簡要的描述工程方案所關心的事項 Our recent effort addressed how to predict the fatigue life nor enhance the yield of a flip chip package. 闡明特定部門或客戶所關心的工程環境 As is well known, geometric parameters significantly affect the reliability of flip chip packaging under thermodynamic loading. Based on the basic material mechanics, a higher solder joint height implies a larger shear force that the solder joint can bear. Moreover, several works have also concluded that cracks occur in a solder joint when a package is under critical thermodynamic loading. Furthermore, certain manufacturing issues, such as packaging falling-off problems, solder bridging and misalignment are also related to the design of the pad and solder joint. 介紹管理問題 However, geometric parameters of a C4 type solder joint still can not accurately predict the reliability of flip chip packaging under thermodynamic loading. Indeed, many engineers have tried to predict the geometric parameters of a C4 type solder joint using an energy-based method and analytical models. Although one of them simulated the C4 type solder joint as a semi-spherical high-lead bump buried into the eutectic solder, the simulation lacks accuracy when the external loading increases. Additionally, the above method disregards the effects of gravity. Moreover, the semi-spherical high-lead bump can not simulate the high-lead bump when the solder pad sizes vary. For instance, if the geometric parameters can not reach an accuracy of 5%, engineers can neither predict the fatigue life nor enhance the yield of a flip chip package. Under these circumstances, engineers can not predict the correct geometric parameters of a C4 type solder joint when the design factors vary. Therefore, engineers can neither predict the fatigue life nor enhance the yield of a flip chip package.

有效撰寫英文工作提案 柯泰德

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