* 如何在論文及技術文件中使用表格 (PART B)
* 助研究思考及寫作的背景音樂 (172)
* 描述學歷背景及已獲成就 (科技求職英文 – 有效撰寫英文職涯經歷) (線上聽力測驗) (6 of 6)
* 工程英文假設描述 (12) (下)
Academic publishing news 學術出版新聞
如何在論文及技術文件中使用表格 (PART B)
* 單個條形圖（single bar graphs）在一個特定的研究對象顯示各種條件的影響。
* 多個條形圖（multiple bar graphs）顯示在同一個條件下不同的研究對象間比較。
* 堆積條形圖（stacked bar graphs）顯示各種項目在整個數量的百分比用來比較和對比數據,。
Ross Daly 居住在希臘克里特島的愛爾蘭音樂家，40年專心於地中海音樂與中世紀冥想音樂
Laura’s interest in biotechnology can be traced back to her first exposure to physiology. She thus completed a master’s degree with an emphasis on biotechnology. In the laboratory, she accumulated much bio-informatics-related knowledge. While pursuing a Master’s degree in Medical Imagery at Yuanpei University of Science and Technology, she conducted biotechnology-related research at the Animal Technology Institute of Taiwan (ATIT). Graduate-level research prepared her for the rigorous demands of generating experimental results and publishing those findings in domestic and international journals. She has acquired fundamental and advanced research capabilities. She has not only nurtured a talent in biotechnology through a multidisciplinary approach, but also widened her field of interest to grasp fully the latest biotechnology-related concepts. Moreover, her participation in research projects that encompassed other seemingly unrelated fields reflects her willingness to absorb tremendous amounts of information and manage her time efficiently. Working at ABC Company would provide Laura with an excellent environment not only to realize fully her career aspirations, but also to apply theoretical knowledge management concepts taught in graduate school, in a practical work setting.
工程英文假設描述 (12) (下)
* 工程目標 : 工程提案的目標 ?
* 達成目標的方法 : 你的計劃中達成目標的步驟?
* 希望的結果 : 希望的結果你希望達成的結果?
* 領域的貢獻 : 你的提案對相關工程領域的貢獻?
工程計劃目標 An analytical geometry method can be devised, capable of accurately predicting the geometric parameters of practical C4 type solder joint in flip chip technology after a reflow process. 達成目標的方法 To do so, the differential equation of curvature can be derived from the well-known Laplace-Young equation. Additionally, the contact angle between the solder and substrate and the surface tension of the solder can be measured. The free surface energy of the substrate and the interfacial tension between the solder and the substrate can then be obtained from Young’s equation. Next, the differential equation of curvature can be numerically solved to obtain the geometric parameters. Moreover, the geometric data of the solder joint can be used as an input in the finite element model to analyze the stress/strain distribution, thermal fatigue life and reliability of the electronic packages. 希望的結果 As anticipated, the proposed methodology can calculate the effect of gravity on the buried high-lead solder bump instead of on the semi-spherical one. Furthermore, the analytical geometry method proposed herein can predict geometric parameters of a C4 type solder joint to within 5% of those obtained by a specific method found in the literature. 領域的貢獻 While considering all of the design factors used to investigate how those factors affect the final shape of a C4 type solder joint, the proposed method provides further insight into how design factors affect the reliability of flip chip technology. The proposed method can also be used to design geometric parameters of a C4 type solder joint, capable of enhancing the reliability of a flip chip package and reducing its stress concentration. Additionally, the results of this study can enhance the reliability and fatigue life of a flip chip package under thermodynamic loading. (NOTE : Add 2-3 more sentences that describe more thoroughly how the proposed method contributes to a particular field or sector)