* 良好的圖形在研究論文和技術文件中的重要性是什麼？ (PART B)
* 如何在論文及技術文件中使用表格 (PART A)
* 助研究思考及寫作的背景音樂 (171)
* 描述學歷背景及已獲成就 (科技求職英文 – 有效撰寫英文職涯經歷) (線上聽力測驗) (5 of 6)
* 工程英文問題描述 (12) (上)
Academic publishing news 學術出版新聞
良好的圖形在研究論文和技術文件中的重要性是什麼？ (PART B)
如何在論文及技術文件中使用表格 (PART A)
Ross Daly 居住在希臘克里特島的愛爾蘭音樂家，40年專心於地中海音樂與中世紀冥想音樂
Tom’s undergraduate training in Radiotechnology and his Master’s degree in Medical Imagery enabled him to acquire sufficient expertise to contribute significantly to Taiwan’s medical sector. He focused on nuclear medicine and radiochemistry, with a particular emphasis on developing radiochemistry-related analytical skills as well as becoming proficient in conducting laboratory experiments. Undergraduate and graduate-level courses in radiochemistry and medical imagery taught him a wide array of theoretical concepts associated with radiopharmaceutical synthesis. Tom’s research at graduate school often involved deriving complex models and modifying clinical practices to meet research requirements. He also attended several international conferences on radiology technology, increasing his exposure to the radiochemistry profession. Moreover, intensive laboratory training enhanced his ability to respond effectively to unforeseen bottlenecks in research. Chang Gung Memorial Hospital will undoubtedly find Tom’s experiences to be a valuable asset to any collaborative effort in which he is engaged.
工程英文問題描述 (12) (上)
* 工程提案建構 : 你工程提案的主題是什麼? 你的讀者可以明瞭工程提案的內容嗎?
* 工程問題 : 你的工程提案裡有你試著要解決或是想更進一步瞭解的問題嗎?
* 工程問題的量化 : 你要如何量化問題來讓你的讀者明白之前文獻研究所遇到的量化限制 ?
* 工程問題的中心 : 如果問題沒被解決或是充分瞭解, 這對工程提案的讀者會有多大的負面衝擊?
* 工程計劃需求 : 根據以上問題,最迫切的計劃需求是什麼?
工程計劃建構 As is well known, geometric parameters significantly affect the reliability of flip chip packaging under thermodynamic loading. Based on the basic material mechanics, a higher solder joint height implies a larger shear force that the solder joint can bear. Moreover, several works have also concluded that cracks occur in a solder joint when a package is under critical thermodynamic loading. Furthermore, certain manufacturing issues, such as packaging falling-off problems, solder bridging and misalignment are also related to the design of the pad and solder joint. 工程計劃問題 However, geometric parameters of a C4 type solder joint still can not accurately predict the reliability of flip chip packaging under thermodynamic loading. Indeed, many engineers have tried to predict the geometric parameters of a C4 type solder joint using an energy-based method and analytical models. Although one of them simulated the C4 type solder joint as a semi-spherical high-lead bump buried into the eutectic solder, the simulation lacks accuracy when the external loading increases. Additionally, the above method disregards the effects of gravity. Moreover, the semi-spherical high-lead bump can not simulate the high-lead bump when the solder pad sizes vary. (NOTE : Add 1-2 more sentences that describe characteristics of the problem or statistics that reflect its severity) 工程計劃問題的量化 For instance, if the geometric parameters can not reach an accuracy of 5%, engineers can neither predict the fatigue life nor enhance the yield of a flip chip package. 工程計劃問題的中心 Under these circumstances, engineers can not predict the correct geometric parameters of a C4 type solder joint when the design factors vary. Consequently, engineers can neither predict the fatigue life nor enhance the yield of a flip chip package. 工程計劃需求 Therefore, an analytical geometry method must be developed, capable of accurately predicting the geometric parameters of practical C4 type solder joint in flip chip technology after a reflow process.